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Applications September, 11, 2025

Automation in the 5G Intelligent Industry

Automation in the 5G Intelligent Industry

Hualing Intelligent Automation Solution for the 5G Intelligent Industry

1. Core of Automation in the 5G Intelligent Industry

The 5G Intelligent Industry is characterized by "adaptation to high-frequency signal transmission, precision of core components, multi-material composite processing, and coexistence of mass production and customization" — core components such as 5G base station ceramic filters, radio frequency (RF) parts, and chip carriers need to meet micron-level machining accuracy to ensure signal stability, adapt to difficult-to-process materials like ceramics, titanium alloys, and high-frequency composite materials, and cope with the dual production rhythms of "mass base station deployment" and "customized terminal components".

Shenzhen Hualing Intelligent Equipment Co., Ltd. (a high-tech enterprise affiliated to Guangdong Creation Century Intelligent Equipment Group) has built an automation solution centered on "precision processing equipment + material adaptation technology + intelligent production collaboration" to address the above demands. Relying on three core product lines (single-head, multi-head, and multi-channel machining centers), it integrates high-rigidity structural design (suppressing cutting vibration of difficult-to-process materials), multi-axis linkage control (enabling complex cavity/surface forming), and intelligent functions such as automatic tool change and on-line inspection, accurately matching the automation goals of the 5G Intelligent Industry for "precision guaranteeing signal quality, efficiency adapting to mass demand, and flexibility responding to customized production".

2. Application Value of Hualing’s Solution

  • Precision & Signal Guarantee:Multi-axis linkage control achieves ±0.005mm-level machining accuracy. Equipped with an on-line inspection system to calibrate dimensional deviations in real time, it avoids 5G filter cavity errors affecting signal transmission. The high-rigidity machine tool structure adapts to the processing of ceramics and high-frequency composite materials, reducing component deformation and ensuring long-term operation stability of 5G equipment.
  • Efficiency & Mass Adaptation:Multi-head machining centers support multi-station simultaneous machining, with efficiency 3 times higher than traditional equipment, enabling rapid handling of mass orders for 5G base station components. Multi-channel machining centers realize "one clamping to complete multiple processes", shortening the production cycle of RF components and matching the rapid deployment rhythm of 5G networks.
  • Flexibility & Cost Optimization:Intelligent systems (automatic tool change, one-click parameter switching) support quick switching of processing specifications to adapt to the demand for customized 5G terminal components, reducing equipment debugging time. Backed by the supply chain resources of Creation Century, it ensures stable supply of core components and lowers equipment procurement and maintenance costs.

3. Segmented Application Scenarios of Automation in the 5G Intelligent Industry

  1. Machining of 5G Base Station Ceramic Filters:Multi-channel machining centers are adopted. The high-rigidity structure suppresses ceramic cutting edge chipping, multi-axis linkage precisely forms the complex cavity of the filter, and on-line inspection corrects dimensions in real time to ensure stable filtering performance.
  2. Machining of 5G Terminal RF Metal Components:Multi-head machining centers realize simultaneous mass processing of "milling + drilling + chamfering" for RF components of mobile phones and IoT devices. The automatic tool change system adapts to multi-specification tools to meet the needs of different terminal RF interfaces.
  3. Precision Machining of 5G Chip Carriers:Single-head machining centers, with high-precision control, complete micron-level hole drilling and surface grinding of chip carriers (such as ceramic substrates and metal heat sinks), ensuring chip heat dissipation and signal transmission efficiency.

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