September, 25, 2025
5G ceramic bottleneck solved! C-400-3D boosts precision, advances smart manufacturing
C-400-3D redefines 5G ceramic processing by overcoming bottlenecks. Critical for 5G gear, ceramics' hardness/brittleness pose challenges.
Industry faces edge chipping (vibration), precision loss (abrasive erosion), and inefficiency (single-head machines).
Key tech:
1. Three-Channel Compensation: 3x efficiency vs single-head, micron precision via parallel processing.
2. Vibration Suppression: High-rigidity bed + algorithms cut vibration >60%, boosting yield.
3. Environmental Control: Temp control + dual cooling keep fluctuations ±0.5℃ for stable precision.
4. Ultra-Sealed Protection: Blocks 99.7% abrasive powder, triples component life, enhancing precision retention.
Applied in 5G filters, base station substrates, smartphone backplanes, aerospace sensors.
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